Polyimide Film Tape (PI Tape) – Before Application
Polyimide Film Tape (PI Tape)
Polyimide Film Tape (PI Tape)
- Tape design, tooling development, die-cutting, and auxiliary material lamination.
- Design of an application-assisted fixture for bonding the tape to the customer’s component.
Our company handled the entire manufacturing and application process.
In this case, the tape had to be applied inside a recessed area, making front-side alignment and pressure application impossible. The installation process was therefore extremely difficult.
This project demonstrates our capability in applying adhesive materials to components with highly challenging bonding positions.
The component being bonded is not manufactured by our company.
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